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High-Performance Circuit Chip with Serial Interface 2 Channels

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xApplications | Pre-Amplifier | Number Of Channels | 2 |
---|---|---|---|
Operating Temperature | -40°C ~ 85°C (TA) | Interface | Serial |
Device Package | 14-TSSOP | Function | Line Driver |
Mounting Type | Surface Mount | Voltage - Supply | 3V ~ 3.6V |
High Light | Surface Mount Integrated Circuit Chip,Multi Channels Integrated Circuit Chip |
Product Description:
This Integrated Circuit Chip is a 14-TSSOP device package with 2 channels that operates in a voltage supply range of 3V ~ 3.6V. The interface is Serial and it functions as a Line Driver. It is designed for use in Chip Board Circuits and is a reliable and versatile Circuit Chip. It is perfect for a variety of applications and offers superior performance. It is a cost-effective solution that ensures high-quality and reliable performance. This integrated Circuit Chip is a great choice for any Chip Board Circuit.
Features:
- Product Name: Digital Integrated Circuit Chip
- Device Package: 14-TSSOP
- Interface: Serial
- Function: Line Driver
- Voltage - Supply: 3V ~ 3.6V
- Mounting Type: Surface Mount
Technical Parameters:
Property | Value |
---|---|
Mounting Type | Surface Mount |
Operating Temperature | -40°C ~ 85°C (TA) |
Number of Channels | 2 |
Function | Line Driver |
Voltage - Supply | 3V ~ 3.6V |
Interface | Serial |
Applications | Pre-Amplifier |
Device Package | 14-TSSOP |
Applications:
The ISSI IS43TR16256B-107MBLI Digital Integrated Circuit Chip board is an excellent choice for a variety of applications. It is manufactured in USA, and is ROHS certified for safety and reliability. It comes in Tape & Reel (TR) packaging for easy storage and can be ordered in quantities of 10 or more with a 5-10 working days delivery time. Payment can be made via T/T, and the chip board can be manufactured in up to 1000pcs/day. This chip board is designed to operate in temperatures ranging from -40°C ~ 85°C (TA) and is used as a line driver and pre-amplifier with 2 channels and a voltage supply of 3V ~ 3.6V.
Packing and Shipping:
The integrated circuit chip must be packaged with the utmost care to ensure that it is not damaged during shipment. The packaging material must be able to withstand shock, vibration, and moisture. All components of the package must be properly secured to prevent any movement. The package must also be labeled with the proper shipping information and bar codes.
The integrated circuit chip must be shipped with a reliable carrier that offers tracking services. The chip should be placed inside a static-shielding bag, placed inside an anti-static foam insert, and then placed inside an ESD-safe box. The box should then be sealed with strong adhesive tape. It should be labeled with the proper shipping information and bar codes.