Industrial networks can control factory workshop equipment, transmit data and images to remote monitors, and achieve seamless communication and data transmission both locally and remotely. Over the years, the Ethernet technology used in this network has evolved from 10BASE-T systems capable of transmitting 10 Mbps to wired Ethernet and wireless 5G transmission networks capable of supporting up to 400 Gbps. This progress relies on network components that connect devices to a local area network (LAN) through Ethernet cables to improve signal transmission and manage data flow.
Designers can choose individual industrial network devices or combine the best components into products that are easy to deploy. Understanding various options is the first step in implementing a future oriented industrial network.
Components for achieving industrial interconnection
In industrial networks, each device contains a physical layer (PHY), which is an Ethernet chip embedded in its printed circuit board (PCB). PHY manages bidirectional communication between devices.
The data leaving the device is usually transmitted through physical media, such as Ethernet cables. The cable and PHY jointly determine the data transmission speed. Most new devices support at least 1000BASE-T Ethernet, which means that the devices can transmit or receive data at speeds of up to 1000 Mbps (or 1 Gb/s) through data lines composed of multiple twisted pair cables.
The Integrated Connector Module (ICM) is located between the PHY and the transmission medium, enabling effective communication between the two. ICM must provide a Media Related Interface (MDI), such as a standard RJ45 Ethernet jack for inserting cables. ICM must also match the impedance of PHY and cable, and provide electrical isolation to protect the connection from surges, ground loops, and signal noise, ultimately ensuring electromagnetic compatibility (EMC) within the system.
The IMC's built-in 1:1 transformer will also be used to isolate the direct current (DC) bias used to operate the PHY from the DC bias used to transmit data or power to connected devices via Power over Ethernet (PoE) technology.
ICM manages PoE by ensuring DC bias between two twisted pair cables used for data transmission or between two unused twisted pair cables in Ethernet cables. PoE can significantly simplify the wiring of factory workshop applications, but careful selection of cables, ICMs, and other network components must be made to ensure minimal EMI.
Play the role of PoE
To implement PoE in industrial environments, engineers need to use LAN transformers such as Pulse Electronics' PulseChip LAN transformer TCxG series (Figure 1). These devices can transmit data at baseband rates of 1 Gbps, 2.5 Gbps, 5 Gbps, or 10 Gbps, as well as 0 to 90 W DC power, through four pairs of twisted pair cables.
PulseChip TCxG series LAN transformers from Pulse Electronics
Figure 1: PulseChip TCxG series LAN transformers paired with magnetic chokes can reduce signal noise and provide 0 W to 90 W DC PoE and up to 10 Gbps data rates. (Image source: Pulse Electronics)
Surface mount device (SMD) iron core transformers have an electrical isolation capability of 1500 VRMS to reduce noise and EMI. The TCxG series meets or exceeds the electrical requirements for Ethernet and Wi Fi communication equipment in the Institute of Electrical and Electronics Engineers (IEEE) 802.3 specification, particularly the 1G, 2.5G, 5G, and 10GBASE-T Ethernet transmission requirements, as well as the IEEE 802.3bt Class 4 6/8 PoE application requirements.
The TCxG series network transformer adopts 1812 (4732) specification magnetic cores, and its design is compatible with standard six pad PCB layout. The TCxG00P series achieves 60 W PoE management capability within a 4.70 ± 0.25 mm x 3.20 mm package. The TCxG001P series transformer can transmit 90 W power and is designed in a 4.60 ± 0.25 mm x 3.40 mm package specifically for small magnetic core layouts. However, Pulse Electronics engineers recommend leaving extra space on the cable side of the transformer to reduce temperature rise at high power. The working temperature of this transformer is -40 ° C to+85 ° C, including temperature rise caused by component self heating.
Both designs have insertion losses of less than -1 dB at frequencies up to 200 MHz. To further reduce signal losses, the TCxG series transformers are specifically designed for use with SMT magnetic chokes, such as Pulse Electronics' PE-0805GCMC series. These choke coils help filter electronic noise in signals and are used in conjunction with LAN transformers at data rates to ensure impedance matching. These chokes are suitable for smaller 0805 (2012) magnetic cores (2.00 mm x 1.2 mm) and can be flexibly placed in PCB design due to the absence of polarity restrictions.
The TCxG transformer and its paired choke adopt a flexible modular design, coupled with support for PoE power supply function, making it an ideal choice for applications such as human-machine interface (HMI), industrial Ethernet LAN switches, routers and servers, as well as 5G and Wi Fi wireless access points (WAP).
Combining Connectivity with ICM
Although specifying LAN transformers and magnetic chokes separately has flexibility, many applications require integrated solutions. ICM integrates LAN transformers with magnetic chokes and RJ45 sockets for Ethernet cable plugs, while maintaining compatibility with commonly used PHY chips.
In Pulse Electronics' Pulsejack JXT7 series Ethernet ICM (Figure 2), these components work together to achieve data rates of up to 10 Gbps as specified by IEEE 802.3an, or multi rate operation of 2.5 Gbps and 5 Gbps as specified by IEEE 802.3bz. This series can also provide up to 140 W DC power as specified by IEEE 802.3bt through 100 foot long unshielded twisted pair (UTP) cables (such as Cat5e or Cat6 cables).
Pulsejack JXT7 series ICM from Pulse Electronics
Figure 2: The Pulsejack JXT7 series ICM combines LAN transformers, magnetic chokes, and RJ45 sockets, supporting data transmission rates of 1 Gbps to 10 Gbps and up to 140 W DC PoE. It is packaged in a sturdy and durable SMD package, making it an ideal choice for WAP. (Image source: Pulse Electronics)
The overall dimensions of JXT7 ICM are 34.29 mm deep, 16.51 mm wide, and 13.33 mm high. It adopts a larger cavity design to cope with possible overheating under high power levels and currents up to 1.3 A. This series features a comprehensive electromagnetic shielding design, including top and bottom EMI spring plates, as well as additional grounding plates. JXT7 ICM is sturdy and durable, suitable for industrial and outdoor applications in the temperature range of -40 ° C to+85 ° C.
Elevate network construction to a new level
ICM is a key component for connecting individual devices to industrial Ethernet networks, but building this network requires switches, routers, and antennas that can match the data transmission rate of the devices. In order to maintain the utilization of factory workshop space achieved by compact ICM and PoE technology, these network devices need to adapt to the existing PCB layout.
One of the methods to achieve this utilization rate is to use Ball Grid Array (BGA), which can achieve high-density packaging of network components in SMD devices. Pulse Electronics' 1-GB SMD BGA Ethernet LAN module (Figure 3) supports Ethernet connections from 10BASE-T to 1000BASE-T, while providing up to 70 W of DC PoE at densities below 140 mm ² per port.
Pulse Electronics' 1Gb SMD BGA Ethernet LAN Module
Figure 3: Pulse Electronics' 1-GB SMD BGA Ethernet LAN module is an upgradable network switch that supports advanced PoE while also supporting data transfer rates of up to 1 Gbps. (Image source: Pulse Electronics)
These units can be installed in locations that support older components with lower data rates or lower power, and can be installed in the space behind a 2xN connector with two rows of ports, each row containing one to eight ports. The rated operating temperature of modules designed for industrial environments is -40 ° C to+80 ° C.
These high-density modules also support the addition of 5G antennas for wireless video communication. 5G application antenna solutions such as Pulse Electronics' antenna (Figure 4) can be installed inside devices on PCBs or flexible circuit boards (FPCs), or externally through hardware or magnets. The selection of antennas depends on the required data transmission rate and bandwidth, the distance to the receiver, and obstacles or interference factors during data transmission.
These antennas support 5G transmission in the mid to low frequency range between 617 MHz and 7125 MHz. Within this frequency band, data can be transmitted from sensors to smart devices at high data rates and low latency.