According to Taiwan's "Zhongshi News Network" report on January 8, the small chip (also known as grain) technology that uses advanced packaging technology to connect several chips with different functions to achieve advanced process chip functions is regarded as China's breakthrough in American chips. A shortcut to a tech embargo. The advanced packaging technology developed by JCET has begun mass production of chip packaging for international customers.
The mobile information app "Quick Technology" reported that in the face of Western countries' embargo on China's semiconductor equipment including extreme ultraviolet (EUV) lithography machines, advanced packaging technologies such as small chips are used to combine chips with mature processes to achieve advanced The technology of process chip functions has become one of the important routes for China to break through the US technology embargo, and it has made significant progress soon.
According to the report, Changdian Technology announced that the XDFOI small chip high-density multi-dimensional heterogeneous integration series process developed by the company has entered the stable mass production stage as planned, and simultaneously realized the shipment of 4nm node multi-chip system integrated packaging products for international customers. A system-in-package with a body area of approximately 1500 mm2.
It is understood that JCET will give full play to the technical advantages of this process and apply it in high-performance computing, artificial intelligence, 5G, automotive electronics and other fields, and provide downstream customers with thinner and thinner appearance, faster data transmission rate, and smaller power loss. chip manufacturing solutions.
The initial development of small chip technology by international semiconductor practitioners was not due to the US technology embargo, but as the advanced manufacturing process continued to deepen, and as the process technology gradually approached the physical limit, the technical competition of semiconductor equipment was fierce, and the price and manufacturing of lithography machines and other equipment The cost is soaring rapidly, forcing the industry to find new alternative technologies, and chiplets are one of them.
The concept of a small chip is not to insist on integrating all transistors into one chip, but to integrate multiple chips with different functions through advanced packaging technology to form a system chip, so that it can be integrated without using advanced process chips. can meet similar performance requirements.
At present, 10 companies, including semiconductor companies such as TSMC and Qualcomm, and IT giants such as Google and Microsoft, have cooperated on small chip technology, released common small chip interconnection standards, and established an industry alliance. China is embargoed because of advanced process equipment, so it wants to use this to break through the chip technology blockade of the United States and have a better chance of overtaking in the semiconductor industry.
